A research team led by Prof. V. Seshu Bai from the School of Physics, University of Hyderabad, has been granted a patent (No. 566008) for their innovative method of preparing ceramic composites reinforced with nanometric alpha alumina platelets. This invention significantly enhances the fracture toughness of alumina parts by up to 80%, while maintaining high flexural strength.

 

Key Features and Applications

The patented technology involves reinforcing alumina with alpha-alumina platelets coated with LaPO4, promoting crack deflection and energy dissipation during loading. This results in improved mechanical properties, particularly the crucial property of fracture toughness, which improvs by 80%, in comparison with pure alumina parts. Since alpha-alumina is the most stable form of alumina, the composite can be used up to high temperatures without degradation. The composite’s stability and strength make it ideal for use in aerospace and automobile components, as thermal insulators, as dental implants etc.

Impact and Innovation


This patent showcases a significant technical advancement in fabricating complex-shaped alumina ceramic parts with significantly improved fracture toughness. The innovative method of fabrication, involving setting of concentrated slurries of a precursor sol in precise moulds fabricated by additive or subtractive manufacturing, enables the production of high-performance components with enhanced durability and reliability. This breakthrough has the potential to benefit various industries and further establish the University of Hyderabad’s research excellence.

 

 

Title: METHOD FOR PREPARING CERAMIC COMPONENTS COMPRISING ALPHA ALUMINA PLATELETS

Patent No. 566008, grant dt. 6th May 2025

 

Authors:  Dr. V. Seshu Bai1, Dr. T. Rajasekharan2, Dr. P. Jeevan Kumar1, Mr. Poly Rose1 and Dr. A. Rajanikanth1

1 School of Physics, University of Hyderabad, Gachibowli, Hyderabad 500046

2 HYMOD Advanced Products & TIDE-Aspire, University of Hyderabad, Hyderabad 500046

 

For any further information may email: seshubai@uohyd.ac.in